Quality with Integrity
Quality with Integrity
8X die stack mass production of high-yield
16X die stack capability
Stealth Dicing Before Grinding (SDBG) technology
With SiP manufacturing and production experience, we can independently complete SiP packaging design and provide customers with full turnkey services.
Provide a complete test program development and program conversion.
Provide correlation analysis of standard engineering samples according to customer requirements.
Conduct electronic failure mode analysis (EFA) on abnormal batches and physical failure mode analysis (PFA) to determine the failure mode.
Our automation system can prevent human errors to the greatest extent and improve production efficiency.
Provide DRAM validation service.
Mainly produce a series of products from GMR to SMR magnetic heads.
Provide customers with PCBA manufacturing services for hard disk drive PCBA and other data storage device businesses.
Manufacturing services for high-precision aluminum substrate products of different sizes.
One-stop services of high-end DRAM/Flash from packaging and testing to finished module production.
Full turnkey packaging, testing and module services
Real-time ESD & environment parameter monitoring and management.
Advanced manufacturing environment and control technology
High-precision automatic head stacks and disk substrate production lines with independent property rights.
Fully autonomous production line
